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Posts Tagged ‘LTE’

Lemko Corporation Launches 100% Virtualized, No Core, M2M Quick-Deploy-Platform™

Lemko Corporation Launches 100% Virtualized, No Core, M2M Quick-Deploy-Platform™

Lemko Corporation, the leader in Virtualized Core Network OS for Super Mobility, launches its 100% virtualized, no core, M2M Quick-Deploy-Platform™. With Lemko's M2M platform connectivity is easier and more secure. Lemko's M2M Quick-Deploy-Platform™ LTE Mini ships pre-tested and pre-configured with an integrated eNodeB radio and distributed and virtualized EPS software. This fit for purpose M2M design supports and enables a wide assortment of LTE M2M applications with shortened M2M application testing and deployment timelines. [...]

Sequans Communications’ LTE Chip Certified by Verizon Wireless

Sequans Communications’ LTE Chip Certified by Verizon Wireless

4G chipmaker Sequans Communications S.A. (NYSE: SQNS) announced that one of its LTE chips has been certified to operate on the Verizon Wireless 4G LTE network. The chip certified is the SQN3120 Mont Blanc platform LTE semiconductor solution, one of Sequans’ StreamrichLTE products for high performance LTE devices. Georges Karam, Sequans CEO said: “Certification by Verizon involves the passing of performance tests that prove our chip’s advanced capabilities. For our device manufacturer customers it ensures a robust solution and [...]

Sierra Wireless Extends 4G Leadership with Introduction of Second Generation of LTE Embedded Modules

Sierra Wireless Extends 4G Leadership with Introduction of Second Generation of LTE Embedded Modules

New ultrathin form factor, Windows® 8 compatibility, and multi-operator LTE support make the newest AirPrime™ MC and EM Series embedded wireless modules ideal for integration into the latest notebooks, ultraportable notebooks, and tablets. Sierra Wireless (NASDAQ: SWIR) (TSX: SW) today introduced its second generation of 4G LTE AirPrime™ embedded wireless modules for notebooks, ultraportable notebooks, and tablets. The six new additions to the AirPrime EM Series and MC Series support 4G LTE networks worldwide and are compatible with [...]

GCT Semiconductor LTE Single-Chip Powers Commercial LTE Machine to Machine (M2M) Module for LGU+

GCT Semiconductor LTE Single-Chip Powers Commercial LTE Machine to Machine (M2M) Module for LGU+

GCT® Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, today announced that its 4G LTE single-chip, GDM7240, powers a new LTE M2M module, commercially available with LGU+, the leading telecommunication service provider in Korea. The new LTE M2M module, packaged as a half-mini-card, successfully completed LGU+’s interoperability testing, and is now commercially available. In addition, GCT and LGU+ continue to collaborate to develop other LTE single-mode applications such as routers. As new LTE [...]

Telit Introduces LTE Module Expanding Automotive Product Line with 4G for North American and European Markets

Telit Introduces LTE Module Expanding Automotive Product Line with 4G for North American and European Markets

New Telit LE920 brings Automotive OEM and aftermarket applications an LTE cellular module delivering 100Mbps download speed with fallback support to HSPA+/GSM/GPRS. Telit Wireless Solutions (http://www.telit.com), a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the LE920 LTE module for European and North American OEM Automotive and aftermarket segments. The new 920 form factor measures 34x40x2.8mm on a 198-pad LGA automotive-grade package. The product [...]

Sequans Introduces StreamliteLTE, a New Line of Chips for the Internet of Things

Sequans Introduces StreamliteLTE, a New Line of Chips for the Internet of Things

Price/performance optimized for consumer electronics and machine-to-machine devices 4G chipmaker Sequans Communications S.A. (NYSE:SQNS) today introduced StreamliteLTE™, a new line of LTE semiconductor solutions aimed at the market for Internet-connected devices. Designed to be the right size at the right cost to enable affordable consumer electronics (CE) and machine-to-machine (M2M) devices for the mass market, StreamliteLTE products deliver the required level of performance for this market plus ultra low power consumption at a low [...]

Altair Semiconductor Achieves Verizon Wireless 4G LTE Chipset Certification

Altair Semiconductor Achieves Verizon Wireless 4G LTE Chipset Certification

Certification Dramatically Reduces Cost and Time to Market for Altair Based machine-to-machine (M2M) and 4G LTE devices. Altair Semiconductor (www.altair-semi.com), the world’s leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets, today announced that its FourGee-3100/6200 chipset has been certified to run over Verizon Wireless’ 4G LTE network. “Completing this certification process with Verizon Wireless is a strategic milestone for Altair,” said Eran Eshed, Co-Founder and VP of Marketing, [...]

Acquisition of Cognovo gives u-blox own 4G chip technology

Acquisition of Cognovo gives u-blox own 4G chip technology

ARM spin-off Cognovo enables u-blox to address new markets for high-speed LTE modems. u-blox (SIX:UBXN), a global leader in positioning and wireless semiconductors, announces the acquisition of UK-based Cognovo Ltd., a company specializing in "Software Defined Modem" (SDM) chip development technology. The acquisition extends u-blox' chip design capabilities to create differentiated products for strategic markets that require 4G communications combined with global positioning. Thomas Seiler, u-blox CEO, said: "This is a very [...]

Sierra Wireless unveils the world’s thinnest 4G LTE embedded module

Sierra Wireless unveils the world’s thinnest 4G LTE embedded module

At only 2.5 mm thick, the new AirPrime™ EM7700 module is ideal for tablets and ultra-portable notebooks, offering the best in portability and connectivity Sierra Wireless (NASDAQ: SWIR) (TSX: SW) today introduced the world's first thin form factor (TFF) embedded wireless module for 4G LTE networks. The AirPrime™ EM7700 embedded wireless module measures only a nominal 2.5 millimeters thick and is designed for use in ultraportable notebooks, tablets, and other devices where thinness is a critical design constraint. Shipments are [...]

Audi works with Sierra Wireless to build and test in-vehicle LTE infotainment system

Audi works with Sierra Wireless to build and test in-vehicle LTE infotainment system

AirPrime™ embedded wireless modules provide reliable LTE connection for research and experimentation for in-vehicle services Sierra Wireless today announced that Audi is using Sierra Wireless AirPrime™ embedded wireless modules to help develop and test an LTE-connected infotainment system. Still in the development and testing stage, the system has been showcased at several industry events this year, including the Consumer Electronics Show (CES) in Las Vegas in January, and CeBIT in Hanover, Germany, in March. Drive tests were [...]

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