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Qualcomm Technologies and Deutsche Telekom Partner on Development Platform for Internet of Everything Applications

Qualcomm Technologies and Deutsche Telekom Partner on Development Platform for Internet of Everything Applications

Plug-and-Play Development Platform Enables Java Developers Worldwide to Prototype, Build and Launch M2M Applications.

Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and Deutsche Telekom today announced that an Internet of Everything (IoE) development platform, based on Qualcomm Technologies’ GobiTM QSC6270-Turbo chipset, will be made available by Deutsche Telekom to application developers in Europe and worldwide. With support for Oracle Java ME Embedded 3.2 available, this IoE development platform is intended to target developers looking to create the next generation of machine-to-machine (M2M) and IoE applications. Deutsche Telekom is already accepting pre-orders for the IoE development platform on its M2M Marketplace (https://marketplace.m2m.telekom.com), and plans to start shipping these development platforms from the second quarter of 2013.

The IoE development platform has been designed to support rapid prototyping, testing and deployment of cellular-enabled IoE applications. By exposing the application processing power of Qualcomm Technologies’ QSC6270-Turbo chipset and allowing developers to write and execute applications directly on the modem chipset, the IoE development platform helps enable additional intelligence and functionality to be added in the end device, along with cellular connectivity.

Deutsche Telekom will utilize the IoE development platform to help accelerate innovation amongst its M2M Developer Community in its quest to enable end-to-end M2M solutions. Oracle Java ME Embedded provides a horizontal platform, and Java technology boasts a community of over 9 million experienced developers worldwide with experience across the broad range of IoE verticals. Deutsche Telekom will make the IoE development platform available with SIM cards from Deutsche Telekom and its portfolio of operators, providing developers with large-scale access to cellular connectivity for their applications.

Thomas Kiessling, chief product and innovation officer at Deutsche Telekom, said:

“The M2M market needs horizontal solutions, from the cellular connectivity enabled by Qualcomm Technologies’ chipsets to the Java programming environment, and they come together nicely in this IoE development platform being launched.”

From first glance, we knew that this piece of hardware would become an important part of our global efforts to grow the M2M ecosystem and market.

Oracle realizes that creating the next wave of Internet-connected devices is just a starting point, but that the real opportunity is in enabling these devices to become a part of a larger and vastly more intelligent system of collecting, processing and acting on data,” said Judson Althoff, senior vice president, Worldwide Alliances and Channels, Oracle.
We are pleased to work with Qualcomm Technologies, Inc. and Deutsche Telekom to make this IoE development platform a tool that Java developers worldwide can use to create cellular connected device-to-data center applications that are the next big business opportunity.

Qualcomm Technologies’ vision of the Internet of Everything involves more than simply enabling devices with cellular connectivity; it is about bringing our industry-leading mobile device technologies to fuel innovation in new verticals,” said Kanwalinder Singh, senior vice president of business development, Qualcomm Technologies, Inc. “We are pleased that Deutsche Telekom and Oracle share our vision that IoE development platforms, such as this platform based on the QSC6270-Turbo chipset, can help solve the needs of developers and customers across industries and geographies, and accelerate the IoE market.

For more information and to see a demonstration of this latest IoE development platform, please visit Qualcomm Technologies during MWC 2013 (Exhibit Hall 3 #3B64), February 25-28 in Barcelona, Spain or visit www.qualcomm.com/IoE. For more information on Deutsche Telekom’s M2M solutions, please visit Deutsche Telekom during MWC 2013 (Exhibit Hall 3 #C114), February 25-28 in Barcelona, Spain or visit www.telekom.com/m2m

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